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IC Packaging Technology Expo


Venue:	Tokyo International Exhibition Center (Tokyo Big Sight)
Country:	Tokyo, Japan
Address:	3-21-1 Ariake, Koto-ku, Tokyo
Date:	18-01-2012 20-01-2012
Category:	Packaging

Description:

ICP - IC PACKAGING TECHNOLOGY EXPO is the most significant exhibition specialised in IC Final Manufacturing, (assembly, test and packaging). ICP gathers all lines of equipment, materials, manufacturing & testing services for manufacturing of fast-developing ICs such as SIPs, WCSPs, BGAs, FCs, etc. And held together is the SUBCONTRACTOR ZONE featuring the World's TOP companies in IC design, assembly and testing services.

Profile:

Coverage Area: 230,873 Square Meter

Visitors: Professionals of semiconductor assembly & electronics manufacturers in fields such as: Production/Manufacturing, Engineering, Jisso, Design, R&D, Quality Control, Purchase etc. are the target visitors.

Exhibitors: Profile for exhibit include Assembly Services, Assembly Equipment, Inspection Equipment, Testers, Measurement Packaging Materials, Components, Other Packaging Technology Packaging Sourcing, Related Services, Semiconductor Packaging Analysis Software, Other IC Packaging Technology Information, Industrial Journals.